Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

Author:

Stam F.A.,Davitt E.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Vincent JH, Harrison MR. IDEALS – Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering. IMAPS Europe Conference Proceedings of the 12th European Microelectronics & Packaging Conference, Harrogate, Yorkshire, England, 7–9 June 1999. p. 98–104

2. Biglari MH, Oddy M, Oud MA, Davis P, de Kluizenaar EE, Langeveld P, Schwarzbach D. Pb-free solders based on SnAgCu, SnAgBi, SnAg and SnCu, for wave soldering of electronic assemblies. Conference Proceedings of Electronics Goes Green 2000+, vol. 1, Berlin, Germany, 11–13 September 2000

3. Kehoe L, Crean GM. Thermal conductivity and specific heat determinations of a set of lead-free solder alloys. Conference Proceedings of the 4th International Symposium and Exhibition on Advanced Packaging Materials, Process, Properties and Interfaces, Braselton, GA, USA, 15–18 March, 1998. p. 203–8

4. Engelmaier W. Design for reliability for surface mount solder attachments: physics of failure and statistical failure distributions. Proceedings of the International Electronics Packaging Conference, Austin, TX, USA, 27–30 September 1992. p. 575–87

5. Suhir E. Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests? Trans ASME 1989;111:310–2

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