Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Reference20 articles.
1. Lau, J., Flip Chip Technologies, McGraw-Hill, New York (1995).
2. Lau, J., Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York (2000).
3. Tummala, R., Fundamentals of Microelectronics Packaging, McGraw-Hill, New York (2001).
4. Wu, T. and Chen, W., “Material and Mechanics Issue in Flip Chip Organic Packaging,” Proceedings of the 46th Electronic Components and Technology Conference, Orlando, FL, 524–534 (1996).
5. Han, B., “Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization using Photomechanics Methods,”Journal of Thermal Stresses,26,583–613 (2003).
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献