Author:
Liu Junchao,Shi Tielin,Xia Qi,Liao Guanglan
Publisher
Springer Science and Business Media LLC
Reference23 articles.
1. Mallik D, Radhakrisham K, He J. Advanced package technologies for high-performance systems. Intel Technology Journal, 2005, 9(4): 259–271
2. Marks M R. Novel deprocessing technique for failure analysis of flip-chip integrated circuit packages. Practical Failure Analysis, 2001, 1(6): 45–52
3. Verma K, Han B. Real-time observation of thermally induced warpage of flip-chip package using far-infrared Fizeau interferometry. Experimental Mechanics, 2004, 44(6): 628–633
4. O’Conchuir D, McCurdy J, Casey V. Survey of non-destructive inspection methods for solder joint integrity. In: Proceedings of the IEEE 1991 National Aerospace and Electronics Conference, Dayton, 1991, 1268–1275
5. Wang Z F, Choudhry M. A study of flip-chip open solder bump failure mechanism. In: Proceedings of the 32nd International Symposium for Testing and Failure Analysis. Austin, 2006, 239–242
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