Advanced Package Technologies for High-Performance Systems-Reference-Cited by-同舟云学术

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Advanced Package Technologies for High-Performance Systems

Published:2005-11-09 Issue:04 Volume:09 Page:
ISSN:1535-864X
Container-title:Intel Technology Journal
language:
Short-container-title:ITJ

Author:

Mallik Debendra

Publisher

Intel

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

2. Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints;Nondestructive Testing and Evaluation;2023-12-08

3. Ultrasonic signal denoising technology based on SMP algorithm;Journal of Physics: Conference Series;2020-05-01

4. Welding defect signal extraction technology based on OMP algorithm;Journal of Physics: Conference Series;2019-04

5. Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities;Nanopackaging;2018

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