Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints
Author:
Affiliation:
1. College of Electrical and Information Engineering, Hunan University, Changsha, China
2. College of Measurement and Testing Engineering, China Jiliang University, Hangzhou, China
Publisher
Informa UK Limited
Subject
General Physics and Astronomy,Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/10589759.2023.2274007
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4. Overview of chip defect detection;Wang X;Modern Manufacturing Technology and Equipment,2022
5. Laser Ultrasonic Inspection of Solder Bumps in Flip-Chip Packages Using Virtual Chip Package as Reference
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