Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling

Author:

Jo Seo Yeon,Sim Gyu-Jang,Park Eun Jeong,Park JinheungORCID,Won Jung YunORCID,Kim Hansol,Lee Myoung-GyuORCID

Funder

National Research Foundation of Korea

Publisher

Elsevier BV

Reference60 articles.

1. Global Automotive Lighting Market Size [2022-2028] | to Reach USD 57.01 Billion at a CAGR of 9.5%: According to Fortune Business Insights, Automotive Lighting Market Size Is Projected to Grow from USD 30.19 Billion in 2021 to USD 57,2022

2. Automobile Mechanical and Electrical Systems;Denton,2023

3. Die attachment, wire bonding, and encapsulation process in LED packaging: a review;Alim;Sensor Actuator Phys.,2021

4. Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations;Elger;Microelectron. J.,2015

5. Investigations on high-power LEDs and solder interconnects in automotive application: Part II—reliability;Schmid;IEEE Trans. Device Mater. Reliab.,2023

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