Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application

Author:

Tan C.W.,Chan Y.C.,Leung Bernard,Liu H.D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Syed N., Woods R.L. Diode laser soldering—a lumped parameter mathematical model and comparison of different optical soldering technologies. IEEE Conf Lasers Electro-opt Europe 2003; p. 594.

2. Controlling the microstructures from the gold-tin reaction;Tsai;J Electron Mater,2005

3. Achievement of homogeneous AuSn solder by pulsed laser-assisted deposition;Belouet;J Electron Mater,1999

4. O’Neill B. Solder selection for photonic packaging. AIM Technical Articles.

5. Flux-free and void free fiber optic packaging assembly process;Barnes,2001

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