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Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint

  • Published:2022-03 Issue: Volume:215 Page:110485
  • ISSN:0264-1275
  • Container-title:Materials & Design
  • language:en
  • Short-container-title:Materials & Design

Author:

Huan Peng-Cheng,Tang Xiao-Xia,Sun Qian,Akira Kato,Wang Xiao-Nan,Wang Jie,Wang Jia-Le,Wei Xia,Di Hong-Shuang

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Project 333 of Jiangsu Province

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference41 articles.

1. Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process[J];Qiao;Mater. Des.,2021

2. Dynamic Weld evolution during ultrasonic welding of Cu–Al joints [J];Ma;Mater. Sci. Eng., A,2021

3. Effect of the scanning path on the nanosecond pulse laser welded Al/Cu lapped joint[J];Zhu;Opt. Laser Technol.,2021

4. Intermetallics-induced directional growth of Sn whiskers in Sn-3.5Ag coating on Al substrate[J];Tian;Appl. Surf. Sci.,2021

5. Laser soldering of flip-chips[J];Kordás;Opt. Lasers Eng.,2006
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