Subject
Condensed Matter Physics,General Materials Science
Reference41 articles.
1. Guo, Y., Chen, W. T. and Lim, C. K. Experimental Determination of Thermal Strains in Semiconductor Packaging Using Moire Interferometry, Proceedings of 1992 Joint ASME/JSME Conference on Electronic Packaging, pp. 779–784, American Society of Mechanical Engineers, New York, 1992
2. Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation
3. Thermal-mechanical strain characterization for printed wiring boards
4. Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
5. Manufacturing stresses in the die due to the die-attach process
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