Author:
Inamdar A.,Gromala P.,Prisacaru A.,Kabakchiev A.,Yang Y.,Han B.
Publisher
Springer International Publishing
Cited by
1 articles.
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1. A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17