The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds

Author:

Linec Mitja,Mušič Branka

Abstract

Global design and manufacturing of the materials with superb properties remain one of the greatest challenges on the market. The future progress is orientated towards researches into the material development for the production of composites of better mechanical properties to the existing materials. In the field of advanced composites, epoxy molding compounds (EMCs) have attained dominance among the common materials due to their excellent properties that can be altered by adding different fillers. One of the main fillers is often based on silicon dioxide (SiO2). The concept of this study was to evaluate the effects of the selected silica-based fillers on the thermal, rheological, and mechanical properties of EMCs. Various types of fillers with SiO2, including crystalline silica and fused silica, were experimentally studied to clarify the impact of filler on final product. Fillers with different shape (scanning electron microscope, SEM), along with different specific surface area (specific surface area analyzer, BET method) and different chemical structure, were tested to explore their modifications on the EMCs. The influence of the fillers on the compound materials was determined with the spiral flow length (spiral flow test, EMMI), glass transition temperature (differential scanning calorimetry, DSC), and the viscosity (Torque Rheometer) of the composites.

Publisher

MDPI AG

Subject

General Materials Science

Reference20 articles.

1. Polymer Materials for Electronics Packaging and Interconnection;Lupinski;ACS Symp. Ser.,1989

2. Phase Separation of Two-Phase Epoxy Thermosets That Contain Epoxidized Triglyceride Oils;Dirlikov,1996

3. Effect of Rubber on Stress-Whitening in Epoxies Cured with 4,4’-Diaminodiphenyl Sulfone;Oh,1996

4. Ultra-low electrical percolation threshold in carbon-nanotube-epoxy composites

5. The Fabrication of Kevlar/Al2O3/Epoxy Resin laminated Composites by Low-Pressure Technique;Kumfu,2011

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