The Effect of Adhesive and Carrier Material Properties on Thermo-Mechanical Stresses of GaSb, InSb Semiconductors due to Cryocooling
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663869.pdf?arnumber=9663869
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1. Midinfrared GaInSb∕AlGaInSb quantum well laser diodes grown on GaAs
2. Ultrahigh Hole Mobility of Sn-Catalyzed GaSb Nanowires for High Speed Infrared Photodetectors
3. Investigation of Warpage Behavior of Silicon Semiconductor on a Silicon-Adhesive-Ceramic Integrated Structure at Cryogenic Temperatures;baloglu;Additional Papers and Presentations,2016
4. Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging
5. Real-time observation of thermally induced warpage of flip-chip package using far-infrared Fizeau interferometry
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