Author:
Liu Junchao,Shi Tielin,Xia Qi,Liao Guanglan
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Brand S, Czurratis P, Hoffrogge P, Petzold M (2010) Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy. Microelectron Reliab 50:1469–1473
2. Chiu SH, Chen C (2006) Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using X-ray microscopy. Appl Phys Lett 89(26):1–3
3. Elger G, Hutter M, Oppermann H, Aschenbrenner R, Reichl H, Jager E (2002) Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering. Microsyst Technol 7(5–6):239–243
4. Heylen W, Lammens S, Sas P (1998) Modal analysis theory and testing. Katholieke Universitiet Leuven, Belgium
5. Huber TM, Fatemi M et al. (2007) Noncontact modal excitation of small structures using ultrasound radiation force. In: Proceedings of the SEM annual conference and exposition on experimental and applied mechanics 1 pp 604–610
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