Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
Author:
Uppal Aastha1, Peterson Jerrod2, Chang Je-Young3, Guo Xi2, Liang Frank4, Tang Weihua1
Affiliation:
1. Intel Corporation, 5000 W. Chandler Boulevard, CH5-157, Chandler, AZ 85226 2. Intel Corporation, 5200 NE Elam Young Pkwy, HF3, Hillsboro, OR 97124 3. Intel Corporation, 5000 W. Chandler Boulevard, CH5-157, Chandler, AZ 85226 e-mail: 4. Intel Corporation, 5200 NE Elam Young Pkwy, HF2, Hillsboro, OR 97124
Abstract
The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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