Die Stacking (3D) Microarchitecture-Reference-Cited by-同舟云学术

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Die Stacking (3D) Microarchitecture

Published:2006-12 Issue: Volume: Page:
ISSN:
Container-title:2006 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO'06)
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Author:

Black Bryan,Pantuso Daniel,Reed Paul,Rupley Jeff,Shankar Sadasivan,Shen John,Webb Clair,Annavaram Murali,Brekelbaum Ned,DeVale John,Jiang Lei,Loh Gabriel H.,McCaule Don,Morrow Pat,Nelson Donald W.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4041820/4041821/04041869.pdf?arnumber=4041869

Cited by 149 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures;ACS Photonics;2024-08-30

2. 3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19

3. Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Neuromorphic System;2024 IEEE International Conference on Advanced Systems and Emergent Technologies (IC_ASET);2024-04-27

4. Efficient Thermal Management Strategies for 3D-SiP Architectures;2024 18th International Conference on Ubiquitous Information Management and Communication (IMCOM);2024-01-03

5. At the Locus of Performance: Quantifying the Effects of Copious 3D-Stacked Cache on HPC Workloads;ACM Transactions on Architecture and Code Optimization;2023-12-14

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