A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism
-
Published:2022-08-18
Issue:
Volume:
Page:
-
ISSN:1955-2513
-
Container-title:International Journal on Interactive Design and Manufacturing (IJIDeM)
-
language:en
-
Short-container-title:Int J Interact Des Manuf
Author:
Nguyen Duc Nam, Dang Minh Phung, Dixit Saurav, Dao Thanh-PhongORCID
Funder
Industrial University of Ho Chi Minh City
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Modeling and Simulation
Reference17 articles.
1. Gao, G., Workman, T., Uzoh, C., Bang, K.M., Mirkarimi, L., Theil, J., Suwito, D., Katkar, R., Fountain, G., Guevara, G., Lee, B.: Die to wafer stacking with low temperature hybrid bonding. In: Proceedings of the Electronic Components and Technology Conference 2020 June, 589–594 (2020). https://doi.org/10.1109/ECTC32862.2020.00098 2. Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.: Towards a complete direct hybrid bonding D2W integration flow: known-good-dies and die planarization modules development. In: 2019 International 3D Systems Integration Conference (2019). https://doi.org/10.1109/3DIC48104.2019.9058783 3. Sanchez, L., Bally, L., Montmayeul, B., Fournel, F., Dafonseca, J., Augendre, E., Di Cioccio, L., Carron, V., Signamarcheix, T., Taibi, R., Mermoz, S., Lecarpentier, G.: Chip to wafer direct bonding technologies for high density 3D integration. In: Proceedings of the Electronic Components and Technology Conference, 1960–1964 (2012). https://doi.org/10.1109/ECTC.2012.6249108 4. Katti, G., Mercha, A., Van Olmen, J., Huyghebaert, C., Jourdain, A., Stucchi, M., Rakowski, M., Debusschere, I., Soussan, P., Dehaene, W., De Meyer, K., Travaly, Y., Beyne, E., Biesemans, S., Swinnen, B.: 3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding. In: 2009 IEEE International Electron Devices Meeting (IEDM), 357–360 (2009). https://doi.org/10.1109/IEDM.2009.5424351 5. Gao, G., Mirkarimi, L., Workman, T., Guevara, G., Theil, J., Uzoh, C., Fountain, G., Lee, B., Mrozek, P., Huynh, M., Katkar, R.: Development of low temperature direct bond interconnect technology for die-to-wafer and die-to-die applications-stacking, yield improvement, reliability assessment. In: 2018 International Wafer Level Packaging Conference (IWLPC), 2018, 1–7 (2018). https://doi.org/10.23919/IWLPC.2018.8573278
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|