Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development-Reference-Cited by-同舟云学术

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Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

Published:2019-10 Issue: Volume: Page:
ISSN:
Container-title:2019 International 3D Systems Integration Conference (3DIC)
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Author:

Bourjot E.,Stewart P.,Dubarry C.,Lagoutte E.,Rolland E.,Bresson N.,Romano G.,Scevola D.,Balan V.,Dechamp J.,Zussy M.,Mauguen G.,Castan C.,Sanchez L.,Jouve A.,Fournel F.,Cheramy S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9043388/9058772/09058783.pdf?arnumber=9058783

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum–Aluminum Thermocompression Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

2. Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. 10 μm and 5 μm Die-to-Wafer Direct Hybrid Bonding;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

4. A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism;International Journal on Interactive Design and Manufacturing (IJIDeM);2022-08-18

5. A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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