Chip to wafer direct bonding technologies for high density 3D integration-Reference-Cited by-同舟云学术

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Chip to wafer direct bonding technologies for high density 3D integration

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Author:

Sanchez L.,Bally L.,Montmayeul B.,Fournel F.,Dafonseca J.,Augendre E.,Di Cioccio L.,Carron V.,Signamarcheix T.,Taibi R.,Mermoz S.,Lecarpentier G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06249108.pdf?arnumber=6249108

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-tier die stacking through collective die-to-wafer hybrid bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Surface Protecting and Particles Removing after Wafer Sawing for Die-to-wafer Hybrid Bonding;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Self-alignment of whole wafers using patterning for capillary forces;Journal of Vacuum Science & Technology B;2023-04-27

5. A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism;International Journal on Interactive Design and Manufacturing (IJIDeM);2022-08-18

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