Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding-Reference-Cited by-同舟云学术

Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding

Published:2023-05 Issue: Volume: Page:
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Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Bourjot Emilie¹,Bond Alice¹,Nadi Noura¹,Enot Thierry¹,Sanchez Loic¹,Montméat Pierre¹,Martin Benoit¹,Campo Alain¹,Fournel Frank¹,Eid Feras²,Swan Johanna²

Affiliation:

1. Univ. Grenoble Alpes,CEA-Leti,Grenoble,France

2. Intel Corporation,Chandler,AZ,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195354.pdf?arnumber=10195354

Reference11 articles.

1. Influence of water diffusion in deposited silicon oxides on direct bonding of hydrophilic surfaces;desomberg;ECS J Solid State Sci Technol,2015

2. Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process;elsherbini;International Electron Devices Meeting (IEDM),0

3. Overview of recent direct wafer bonding advances and applications

4. Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield;mermoz;IEEE International 3D Systems Integration Conference (3DIC),2011

5. Self-Assembly process for 3D Die-to-Wafer using direct bonding: A step forward toward process automatisation;jouve;IEEE Electronic Components and Technology Conference (ECTC),2019

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