Analytical and Experimental Hybrid Study on Thermal Fatigue Strength of Electronic Solder Joints. 1st Report. Rationalization of Accelerated Thermal Cyclic Test and Evaluation of Thermal Fatigue.-Reference-Cited by-同舟云学术

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Analytical and Experimental Hybrid Study on Thermal Fatigue Strength of Electronic Solder Joints. 1st Report. Rationalization of Accelerated Thermal Cyclic Test and Evaluation of Thermal Fatigue.

Published:1998 Issue:619 Volume:64 Page:550-557
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

YU Qiang,SHIRATORI Masaki,WANG Shubo,KANEKO Seiji,ISHIHARA Tatsuya

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.jstage.jst.go.jp/article/kikaia1979/64/619/64_619_550/_pdf

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Use of Modified Accumulated Damage Model to Predict Fatigue Failure Lives of Sn-Ag-Cu-based Solder Joints in Ball-Grid-Array-Type Packages;Transactions of The Japan Institute of Electronics Packaging;2012

2. Fatigue Life Evaluation of Sn3Ag0.5Cu Solder Joints after High Temperature Holding;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2012

3. Use of Modified Accumulated Damage Model to Predict Fatigue Failure-life of Sn-Ag-Cu Based Solder Joints in Ball-Grid-Array-Type Packages;Journal of Japan Institute of Electronics Packaging;2011

4. 10.5104/jiep.13.497;Journal of Japan Institute of Electronics Packaging;2010

5. EVALUATION OF THERMAL-MECHANICAL FATIGUE BEHAVIOR FOR 62Sn-38Pb BULK SOLDER;Experimental Techniques;2003-03

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