Use of Modified Accumulated Damage Model to Predict Fatigue Failure-life of Sn-Ag-Cu Based Solder Joints in Ball-Grid-Array-Type Packages-Reference-Cited by-同舟云学术

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Use of Modified Accumulated Damage Model to Predict Fatigue Failure-life of Sn-Ag-Cu Based Solder Joints in Ball-Grid-Array-Type Packages

Published:2011 Issue:4 Volume:14 Page:287-295
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Terasaki Takeshi,Tanie Hisashi,Chiwata Nobuhiko,Wakano Motoki,Fujiyoshi Masaru

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep/14/4/14_4_287/_pdf

Reference22 articles.

1. Analytical and Experimental Hybrid Study on Thermal Fatigue Strength of Electronic Solder Joints. 1st Report. Rationalization of Accelerated Thermal Cyclic Test and Evaluation of Thermal Fatigue.

2. 2) 寺崎健,長埜浩太,三浦英生,中塚哲也:"周辺端子型LSIパッケージにおけるはんだ接合部の熱疲労寿命予測,"第7回「エレクトロニクスにおけるマイクロ接合.実装技術」シンポジウム論文集,pp. 441–446, 2001

3. Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

4. Crack Propagation Behaviour of Four Types of Lead and Lead-Free Solders in Push-Pull Low Cycle Fatigue.

5. Recent Progress of Experimental and Measuring Technology. Evaluation of Crack Propagation for Sn63-Pb37 Solder Bumps.

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