Fatigue Life Evaluation of Sn3Ag0.5Cu Solder Joints after High Temperature Holding-Reference-Cited by-同舟云学术

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Fatigue Life Evaluation of Sn3Ag0.5Cu Solder Joints after High Temperature Holding

Published:2012 Issue:793 Volume:78 Page:1314-1324
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

KAWANO Kenya¹,NAKA Yasuhiro¹,TANIE Hisashi¹

Affiliation:

1. Hitachi Research Laboratory, Hitachi, Ltd.

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia/78/793/78_1314/_pdf

Reference6 articles.

1. Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints

2. (4) Morris, Jr., J. W. , “Solder Joint Reliability”, Van Nostrand Reinhold, Vol. 225 (1991).

3. Effects of Hold-Time on Thermal Fatigue Life of Solder Joints.

4. Analytical and Experimental Hybrid Study on Thermal Fatigue Strength of Electronic Solder Joints. 1st Report. Rationalization of Accelerated Thermal Cyclic Test and Evaluation of Thermal Fatigue.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Verification of creep properties and rupture lifetime evaluation methods using small diameter Sn-3.0Ag-0.5Cu/Sn-58Bi/Sn-5Sb specimens;Microelectronics Reliability;2022-09

2. Challenge of Establishing Materials Testing Standards with Miniature Specimen for Solders;Materials Performance and Characterization;2022-04-05

3. Effect of Additive Elements on Crack Initiation and Propagation Behavior at Stress Concentration Part for Sn-58Bi Solders;Journal of the Society of Materials Science, Japan;2017

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