EVALUATION OF THERMAL-MECHANICAL FATIGUE BEHAVIOR FOR 62Sn-38Pb BULK SOLDER
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. A fracture mechanics approach to thermal fatigue life prediction of solder joints
2. 2. J.K. Tien , Creep-fatigue Interactions in Solders , IEEE Trans, CHMT-12, 502 -505 (1989 ).
3. Experimental and numerical investigations of thermo-mechanically stressed micro-components
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure;Microelectronics Reliability;2017-08
2. Effect of loading type on fatigue crack growth behavior of solder joint in electronic packaging;Acta Mechanica Solida Sinica;2014-06
3. Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads;Chinese Physics B;2014-04
4. Effects of solder balls and arrays on the failure behavior in Package-on-Package structure;Microelectronics Reliability;2014-03
5. Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model;Microelectronics Reliability;2013-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3