Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
https://iopscience.iop.org/article/10.1088/1674-1056/23/4/044601/pdf
Reference22 articles.
1. Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps
2. Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
3. SEM in-situ investigation on failure of nanometallic film/substrate structures under three-point bending loading
4. SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging
5. A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits
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1. Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events;Microelectronics Reliability;2018-01
2. Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure;Microelectronics Reliability;2017-08
3. Evaluation of the critical stress of anodized coating-AZ91D substrate using SEM in-situ technology;J ZHEJIANG UNIV-SC A;2016
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