A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits-Reference-Cited by-同舟云学术

A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits

Published:2007-06 Issue:6 Volume:47 Page:986-995
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ročak D.,Maček S.,Sitek J.,Hrovat M.,Bukat K.,Drozd Z.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Drozd Z, Szwech M. Selected quality characteristics of soldered joints. In: Proceedings of 23rd international spring seminar on electronics technology, Balatonfured, Hungary, May 2000. p. 235–40.

2. Dunford SO, Viswandham P, Rautila P. On the road to lead free, Circuits assembly, April 2001. p. 34–40.

3. Kisiel R. Resistivity of lead-free solder joints. In: Proceedings of ISSSE 98, 21st international spring seminar on electronics technology, Neusiedl am See. Austria, May 1998. p. 32–3.

4. Testing of lead-free solder pastes for component soldering on printed and hybrid circuit;Ročak;Inf MIDEM,2002

5. A comparison of the quality of lead-free solder pastes;Sitek;Solder Surf Mt Technol,2004

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of loading type on fatigue crack growth behavior of solder joint in electronic packaging;Acta Mechanica Solida Sinica;2014-06

2. Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads;Chinese Physics B;2014-04

3. Corrosion behavior of Sn–3.0Ag–0.5Cu solder under high-temperature and high-humidity condition;Journal of Materials Science: Materials in Electronics;2014-01-18

4. Assessing the replacement of lead in solders: effects on resource use and human health;Journal of Cleaner Production;2013-05

5. SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging;Microelectronics Reliability;2011-08