Board level drop test and simulation of leaded and lead-free BGA-PCB assembly-Reference-Cited by-同舟云学术

Board level drop test and simulation of leaded and lead-free BGA-PCB assembly

Published:2007-12 Issue:12 Volume:47 Page:2197-2204
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Qu Xin,Chen Zhaoyi,Qi Bo,Lee Taekoo,Wang Jiaji

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

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4. Yamaji Y, Suzuki T, Yamasaki H, et al. New evaluation methods of CSPs board level reliability using strain gauge. In: Proceedings of 50th electronic packaging technology conference, May 21–24; 2000. p. 1398–404.

5. Effect of the drop impact on BGA/CSP package reliability;Mishiro;Microelectron Reliab,2002

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