Effect of the drop impact on BGA/CSP package reliability-Reference-Cited by-同舟云学术

Effect of the drop impact on BGA/CSP package reliability

Published:2002-01 Issue:1 Volume:42 Page:77-82
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Mishiro Kinuko,Ishikawa Shigeo,Abe Mitsunori,Kumai Toshio,Higashiguchi Yutaka,Tsubone Ken-ichiro

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Board assembly technology and reliability of D2BGA CSP;Hirayama;J Jpn Inst Electron Packaging,1998

2. The reliability for μBGA;Nishiyama;J Jpn Inst Electron Packaging,1998

3. Effects of BGA solder geometry on fatigue life and reliability assessment;Yu;J Jpn Inst Electron Packaging,1998

4. Kimura T, et al. CSP packaging and mounting technologies for mobile apparatus. Proceedings of 1997 International Symposium on Microelectronics, 1997. p. 256–61

5. The role of case-rigidity in drop-tolerance of portable products;Goyal;The Int J Microcircuits and Electron Packaging,1999

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