A fracture mechanics approach to thermal fatigue life prediction of solder joints-Reference-Cited by-同舟云学术

A fracture mechanics approach to thermal fatigue life prediction of solder joints

Published:1992 Issue:4 Volume:15 Page:559-570
ISSN:0148-6411
Container-title:IEEE Transactions on Components, Hybrids, and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Comp., Hybrids, Manufact. Technol.

Author:

Pao Y.-H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials

Link

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