Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
Author:
Xiao Qiang1, Bailey Harold J.1, Armstrong William D.1
Affiliation:
1. Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071
Abstract
Relationships between microstructural and mechanical aging effects in eutectic PbSn and Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared. The room temperature aged Sn3.9Ag0.6Cu alloy continually age-softened, this softening correlated with the growth of relatively large tin-rich crystals. The 180°C aged Sn3.9Ag0.6Cu alloy initially age-softened, and the minimum flow strength was reached after one day at 180°C. This softening correlated with the growth of relatively large tin-rich crystals and with the coarsening of Ag3Sn particles. When aged at 180°C beyond one day the Sn3.9Ag0.6Cu alloy age-hardened, the hardening correlated with the dispersion of Ag3Sn particles into tin-rich crystals which previously had not contained intermetallic precipitates.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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