Author:
Ghenam Sinda,Elhami Abdelkhalak,Akrout Ali,Gafsi Wajih,Haddar Mohamed
Publisher
Springer International Publishing
Reference10 articles.
1. Halouani, A., Abel, C., Mohamed, H.: Modélisation et Simulation Multi-Physique Pour La Fiabilisation Des Composants Électroniques (2020)
2. Depiver, J.A., Mallik, S., Amalu, E.H.: Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions. Eng. Fail. Anal. 125, 10544 (2021)
3. Lecture Notes in Mechanical Engineering;Sinda Ghenam,2022
4. Wang, H., Liserre, M., Blaabjerg, F.: Toward reliable power electronics: challenges, design tools, and opportunities. IEEE Ind. Electron. Maga. 7(2), 17–26 (2013)
5. Makhloufi, A., Aoues, Y., el Hami, A.: Reliability based design optimization of wire bonding in power microelectronic devices. Microsyst. Technol. 22(12), 2737–2748 (2016)