Experimental and Modeling Studies of Looping Process for Wire Bonding-Reference-Cited by-同舟云学术

Experimental and Modeling Studies of Looping Process for Wire Bonding

Published:2013-11-18 Issue:4 Volume:135 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Wang Fuliang¹,Chen Yun²

Affiliation:

1. e-mail:

2. State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

Abstract

Looping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a high-speed camera, and the evolution of wire profiles during looping and the capillary trace were obtained through experiments. A dynamic finite element (FE) model was developed to learn the details of the looping process, where real capillary geometry dimensions, capillary trace, diameter of bonded ball and the gold wire material were used, and the friction force and air tension force were considered. The simulated profiles were compared with those of the experiment. Using the verified FE model, the effects of material properties, capillary parameters, and capillary traces on the looping process were studied, and the relationships between the final profiles and parameters were discussed.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4025667/6139754/ep_135_04_041009.pdf

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