Improving the wire bonding process quality using statistically designed experiments-Reference-Cited by-同舟云学术

Improving the wire bonding process quality using statistically designed experiments

Published:1999-02 Issue:2 Volume:30 Page:161-168
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Antony Jiju

Publisher

Elsevier BV

Subject

General Engineering

Reference15 articles.

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5. Variation reduction by the use of designed experiments;Sirvanci;Quality Engineering,1993

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