Machine learning enables accurate wire loop profile prediction for advanced microelectronics packaging-Reference-Cited by-同舟云学术

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Machine learning enables accurate wire loop profile prediction for advanced microelectronics packaging

Published:2022-12 Issue: Volume:84 Page:394-402
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Hou Maoxiang,Ou Zhengping,Long Junyu,Ding Shuquan,Wen Guanhai,Chen Yun,Chen Xin

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Special Project for Research and Development in Key areas of Guangdong Province

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference44 articles.

1. A brief review of selected aspects of the materials science of ball bonding;Breach;Microelectron Reliab,2010

2. Flexible polyimide-based hybrid opto-electric neural interface with 16 channels of micro-LEDs and electrodes;Ji;Microsyst Nanoeng,2018

3. Impedance modeling of ultrasonic transducers used in heavy aluminum wire bonding;Long;IEEE Trans Compon Packag Manuf Technol,2018

4. Study of complex looping with five kinks in thermosonic wire bonding by using variable-length link-spring model;Wang;IEEE Trans Compon Packag Manuf Technol,2019

5. Interfacial laser-induced graphene enabling high-performance liquid−solid triboelectric nanogenerator;Chen;Adv Mater,2021

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1. Dual-indicators machine learning assisted processing high-quality laser-induced fluorine-doped graphene and its application on droplet velocity monitoring sensor;Carbon;2024-06

2. A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis;Surfaces and Interfaces;2024-01

3. Thermal Concentrating Efficiency Enhanced for Multilayer Circular Thermal Concentrators with Gradient Structures;2024

4. Research Progress on Bonding Wire for Microelectronic Packaging;Micromachines;2023-02-11

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