Influence of capillary trace on the wire bond loop profile
Author:
Affiliation:
1. Guilin University of Electronic Technology,School of Mechanical and Electrical Engineering,Guilin,China,541000
2. China Zhenhua Electronics Group Co., Ltd,Fengguang Semiconductor Co., LTD,Guiyang,China,550018
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873313.pdf?arnumber=9873313
Reference13 articles.
1. Three dimensional finite element simulation of wire looping process in wirebonding;ng;Electronics Packaging Technology Conference,2003
2. Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wire
3. Robust Image Corner Detection Based on the Chord-to-Point Distance Accumulation Technique
4. Study on the Effects of Capillary Reverse Loop for Wire Profiles in Wirebonding Loops;zhou;Semiconductor technology,2010
5. Wire bond development for high-pincount surface-mount
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