Enhanced Heat Transfer Using Microporous Copper Inverse Opals-Reference-Cited by-同舟云学术

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Published:2018-05-09 Issue:2 Volume:140 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Lee Hyoungsoon¹,Maitra Tanmoy²,Palko James³,Kong Daeyoung¹,Zhang Chi⁴,Barako Michael T.⁴,Won Yoonjin⁵,Asheghi Mehdi⁴,Goodson Kenneth E.⁴

Affiliation:

1. School of Mechanical Engineering, Chung-Ang University, 84, Heukseok-ro, Dongjak-gu 06974, Seoul, South Korea e-mail:

2. Mechanical Engineering, University College London, Gower St. Bloomsbury, London WC1E 6BT, UK e-mail:

3. Department of Mechanical Engineering, University of California, Merced, 5200 N. Lake Rd, Merced, CA 95343 e-mail:

4. Department of Mechanical Engineering, Stanford University, 440 Escondido Mall, Stanford, CA 94305 e-mail:

5. Department of Mechanical and Aerospace Engineering, University of California, Irvine, 4200 Engineering Gateway, Irvine, CA 92697 e-mail:

Abstract

Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance pool boiling performance using a thin CIO film with a thickness of ∼10 μm and pore diameter of 5 μm. The microfabricated CIO film increases microscale surface roughness that in turn leads to more active nucleation sites thus improved boiling performance parameters such as heat transfer coefficient (HTC) and critical heat flux (CHF) compared to those of smooth Si surfaces. The experimental results for CIO film show a maximum CHF of 225 W/cm2 (at 16.2 °C superheat) or about three times higher than that of smooth Si surface (80 W/cm2 at 21.6 °C superheat). Optical images showing bubble formation on the microporous copper surface are captured to provide detailed information of bubble departure diameter and frequency.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4040088/6142945/ep_140_02_020906.pdf

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