Author:
Kong Daeyoung,Kim Kiwan,Jung Euibeen,Jiang Katherine,Wu Qianying,Jang Bongho,Kwon Hyuk-Jun,Asheghi Mehdi,Goodson Kenneth E.,Lee Hyoungsoon
Reference43 articles.
1. Impact of embedded liquid cooling on the electrical characteristics of GaN-on-Si power transistors;Nela;IEEE Electron Device Lett.,2021
2. Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow;Bar-Cohen,2018
3. The ICECool fundamentals effort on evaporative cooling of microelectronics;Bar-Cohen;IEEE Trans. Compon., Packag. Manufact. Technol.,2021
4. Review of nanoscale boiling enhancement techniques and proposed systematic testing strategy to ensure cooling reliability and repeatability;Liang;Appl. Therm. Eng.,2021
5. Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72;Rainey;J. Heat Transfer,2000
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