Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels

Author:

Kong DaeyoungORCID,Kwon Heungdong,Jang Bongho,Kwon Hyuk-Jun,Asheghi Mehdi,Goodson Kenneth E.,Lee Hyoungsoon

Publisher

Elsevier BV

Reference56 articles.

1. A critical review of traditional and emerging techniques and fluids for electronics cooling;Sohel Murshed;Renew Sustain Energy Rev,2017

2. A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs;Pengelly;IEEE Trans Microwave Theory Techn,2012

3. The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics;Bar-Cohen;IEEE Trans Compon, Packag Manufact Technol,2021

4. Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management;Li;Appl Therm Eng,2024

5. Near-junction microfluidic cooling for high power-density GaNon-Si electronics: A wafer, device, packaging, and system-level investigation;van Erp,2022

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