Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill-Reference-Cited by-同舟云学术

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Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

Published:2008 Issue:3 Volume:72 Page:244-248
ISSN:1880-6880
Container-title:Journal of the Japan Institute of Metals
language:ja
Short-container-title:J. Japan Inst. Metals

Author:

Tohei Tomotake,Shohji Ikuo,Yoshizawa Keisuke,Nishimoto Masaharu,Kawano Takayuki,Mizutani Yumiko,Ohsaki Yoshihiko

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://www.jstage.jst.go.jp/article/jinstmet/72/3/72_3_244/_pdf

Reference11 articles.

1. 1) J. H. Lau and Y. H. Pao: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (McGraw-Hill, 1997).

2. Characterization of chip scale packaging materials

3. Effects of BGA Solder Geometry on Fatigue Life and Reliability Assessment.

4. Rupture Life of CSP Solder Joints with Sn-Ag Lead-Free Solders under Thermal Cycle Condition.

5. Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A newly developed rapid uniform thermal cycle test system for electronic components;Microelectronics Reliability;2017-11

2. A Newly-Developed Nondestructive Quantitative Thermal Fatigue Damage Evaluation Method Using Resistance Changes for Micro Joints of Electronic Components;Journal of Japan Institute of Electronics Packaging;2017

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