Abstract
The effect of the mechanical and physical properties of an underfill material on thermal
stress relief in a lead-free chip size package (CSP) solder joint has been investigated. Thin sheets of
underfill materials for the CSP solder joint were prepared and the mechanical and physical
properties of the sheets were investigated. Using these properties, thermal stress relief in an
encapsulated CSP lead-free solder joint with the underfill material was examined by a finite element
analysis method under thermal cycle conditions in the temperature range from 293K to 398K and
233K.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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