A newly developed rapid uniform thermal cycle test system for electronic components-Reference-Cited by-同舟云学术

A newly developed rapid uniform thermal cycle test system for electronic components

Published:2017-11 Issue: Volume:78 Page:53-64
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ikuno Hajime

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

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5. Effect of porosity on thermal fatigue lives of AC2B aluminum alloy castings;Ikuno;J. Jpn. Inst. Light Met.,1995

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