Rupture Life of CSP Solder Joints with Sn-Ag Lead-Free Solders under Thermal Cycle Condition.
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
http://www.jstage.jst.go.jp/article/jiep1998/4/4/4_4_289/_pdf
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill;Journal of the Japan Institute of Metals;2008
2. Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints;Transactions of The Japan Institute of Electronics Packaging;2008
3. Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device;JSME International Journal Series A;2006
4. Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint;MATERIALS TRANSACTIONS;2005
5. Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index;MATERIALS TRANSACTIONS;2005
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