Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index
Author:
Affiliation:
1. Faculty of Engineering, Gunma University
2. Graduate School of Engineering, Osaka University
3. Joining and Welding Research Institute, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/46/11/46_11_2329/_pdf
Reference30 articles.
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3. 3) Y. Kariya and M. Otsuka: J. Electron. Mater. 27 (1998) 1229–1234.
4. 4) J. H. Lau: Solder Joint Reliability (Van Nostrand Reinhold, 1991).
5. 5) J. H. Lau and Yi-H. Pao: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (McGraw-Hill, 1997).
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