Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint-Reference-Cited by-同舟云学术

Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint

Published:2005 Issue:12 Volume:46 Page:2725-2729
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Shohji Ikuo¹,Goto Hiroki¹,Nakamura Kiyotomo²,Ookubo Toshikazu²

Affiliation:

1. Faculty of Engineering, Gunma University

2. Toppan Printing Co., Ltd.

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/46/12/46_12_2725/_pdf

Reference11 articles.

1. 1) W. J. Plumbrige, R. J. Matela and A. Westwater: Structural integrity and reliability in electronics (Kluwer Academic Publishers, 2003).

2. 2) M. E. Loomans, S. Vaynman, G. Ghosh and M. E. Fine: J. Elecron. Mater. 23 (1994) 741–746.

3. 3) I. Artaki, A. M. Jackson and P. T. Vianco: J. Elecron. Mater. 23 (1994) 757–764.

4. 4) Y. Kariya, K. Nakamura, Y. Tanaka and M. Otsuka: Proc. of 6th symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2000) pp. 217–222.

5. 5) I. Shohji, F. Mori and K. F. Kobayashi: Mater. Trans. 42 (2001) 790–793.

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