Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device-Reference-Cited by-同舟云学术

Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Published:2006 Issue:2 Volume:49 Page:220-228
ISSN:1344-7912
Container-title:JSME International Journal Series A
language:en
Short-container-title:JSME Int. J., Ser. A

Author:

NAGANO Kohta¹,YAGUCHI Akihiro²,TERASAKI Takeshi²,YAMAMOTO Kenichi³

Affiliation:

1. Material Research Laboratory, Hitachi Ltd.

2. Mechanical Engineering Research Laboratory, Hitachi Ltd.

3. Renesas Technology Corp.

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,General Materials Science

Link

http://www.jstage.jst.go.jp/article/jsmea/49/2/49_2_220/_pdf

Reference16 articles.

1. (1) Yu, Q., Shiratori, M. and Kim, D., Strength Evaluation for Brittle Failure of Intermetallic Compound Layer in Solder Joints, Microjoining and Assembly Technology in Electronics 2001, (in Japanese), (2001), pp.47-53.

2. (2) The Japan Society of Mechanical Engineers, Influence of Intermetallics in Connected Reliability of Solder Joint, Report of Study on Reliability for Electronics Packaging (RC181), (in Japanese), (2000), pp.345-368.

3. (4) The Japan Society of Mechanical Engineers, Evaluation of Thermal Fatigue Life in BGA Solder Joint of Pb-Free, Report of Study on Reliability for Electronics Packaging (RC181), (in Japanese), (2000), pp.313-343.

4. Rupture Life of CSP Solder Joints with Sn-Ag Lead-Free Solders under Thermal Cycle Condition.

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