1. (1) Yu, Q., Shiratori, M. and Kim, D., Strength Evaluation for Brittle Failure of Intermetallic Compound Layer in Solder Joints, Microjoining and Assembly Technology in Electronics 2001, (in Japanese), (2001), pp.47-53.
2. (2) The Japan Society of Mechanical Engineers, Influence of Intermetallics in Connected Reliability of Solder Joint, Report of Study on Reliability for Electronics Packaging (RC181), (in Japanese), (2000), pp.345-368.
3. (4) The Japan Society of Mechanical Engineers, Evaluation of Thermal Fatigue Life in BGA Solder Joint of Pb-Free, Report of Study on Reliability for Electronics Packaging (RC181), (in Japanese), (2000), pp.313-343.
4. Rupture Life of CSP Solder Joints with Sn-Ag Lead-Free Solders under Thermal Cycle Condition.