High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies-Reference-Cited by-同舟云学术

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Author:

Wong E.H.,Seah S.K.W.,Selvanayagam C.S.,Rajoo R.,van Driel W.D.,Caers J.F.J.M.,Zhao X.J.,Owens N.,Leoni M.,Tan L.C.,Lai Y.-S.,Yeh C.-L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

Reference18 articles.

1. Joint Electron Device Engineering Council Standard JESD22-B111 (2003).

2. E.H. Wong, K.M. Lim, N. Lee, S. Seah, C. Koh, and J. Wang, Proc. 4th Electron. Packag. Technol. Conf. (Singapore, 2002), pp. 327–333.

3. J. Varghese and A. Dasgupta, Proc. ASME Int. Mech. Eng. Congress & Exposition, IMECE2003-41844 (Washington, DC, 2003), pp. 1–7.

4. D. Reiff and E. Bradley, Proc. 55th Electron. Comp. Technol. Conf. (Orlando, FL, 2005), pp. 1519–1525.

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