Wettability of Low Silver Content Lead-Free Solder Alloy
Author:
Affiliation:
1. Department of Engineering Design and Manufacture, University of Malaya
2. Department of Material Science, School of Engineering, Tokai University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/50/5/50_M2009024/_pdf
Reference14 articles.
1. 1) H. Wang, F. W. F. Gao, X. Ma and Y. Qian: J. Alloy. Compd. 433 (2007) 302–305.
2. 2) L. N. Brush and R. N. Gruge: Mater. Sci. Eng. A 238 (1997) 176–171.
3. 3) Y.-fu Yan, J.-hong Zhu, F.-xiao Chen, J.-guang He and D.-xin Yang: T. Nonferr. Metal. Soc. 16 (2006) 1116–1120.
4. 4) H. S.-Hwan, K. K.-Soo and K. Suganuma: Mater. Trans. 42 (2001) 739–744.
5. 5) Metal Handbook: Welding, brazing, and Soldering, 9th ed., 6 (American Society for Metal, Ohio, 1983).
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