Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder

Published:2001 Issue:5 Volume:42 Page:739-744
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Huh Seok-Hwan¹,Kim Keun-Soo¹,Suganuma Katsuaki¹

Affiliation:

1. Institute of Scientific and Industrial Research, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/42/5/42_5_739/_pdf

Reference12 articles.

1. 1) M. Abtew and G. Selevaduray: Mater. Sci. Eng. 27 (2000) 95–141.

2. 2) K. Suganuma: Current Opinion in Materials Science (2001) in press.

3. 3) K. Suganuma and Y. Nakamura: J. Japan Inst. Metals 59 (1995) 1299–1305.

4. 4) K. Suganuma, S. H. Huh, K. S. Kim, H. Nakase and Y. Nakamura: Mater, Trans, (2001) in press.

5. 5) J. H. Vincent and G. Humpston: GEC Journal of Research, 11 (1994) 76–89.

Cited by 63 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of In and aging treatment on the microstructure, mechanical properties and electrochemical corrosion behavior of Sn 2Cu solder alloy;Materials Characterization;2024-03

2. The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder;Physics of Metals and Metallography;2023-12-29

3. Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic;Results in Materials;2022-12

4. Spiral-eutectic-reinforced Biodegradable Zn–Mg–Ag Alloy Prepared via Selective Laser Melting;Chinese Journal of Mechanical Engineering: Additive Manufacturing Frontiers;2022-06

5. Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate;Transactions of Nonferrous Metals Society of China;2019-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3