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Creep behavior on Ag particle reinforced SnCu based composite solder joints

  • Published:2006-10 Issue:5 Volume:16 Page:1116-1120
  • ISSN:1003-6326
  • Container-title:Transactions of Nonferrous Metals Society of China
  • language:en
  • Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

YAN Yan-fu,ZHU Jin-hong,CHEN Fu-xiao,HE Jun-guang,YANG Di-xin

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference17 articles.

1. The effect of an electric current on rod-eutectic solidification in Sn-0.9wt.%Cu alloys [J];BRUSH;Materials Science and Engineering,1997

2. Phase analysis in the solder joints of SnCu solder/IMC/Cu substrate [J];LEE;Materials Characterization,1999

3. On the interfacial composition of vapor deposited Bi-layer thin film of SnCu on the glass substrate [J];DHABAL;Applied Surface Science,2003

4. HAMPSHIRE W B. The search for lead-free solders [A]. Surface Mount International Conference [C]. San Jose, CA, 1992: 729–737.

5. Quantitication of creep strain distribution in small crept lead-free in-situ composite and non-composite solder joints [J];MCDOUGALL;Materials Science and Engineering,2000

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