Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders-Reference-Cited by-同舟云学术

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Published:2017-01-04 Issue:7 Volume:46 Page:4076-4084
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Nobari Amir Hossein,Maalekian Mehran,Seelig Karl,Pekguleryuz Mihriban

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-016-5181-2/fulltext.html

Reference25 articles.

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2. A.J. Boesenberg, I.E. Anderson, and J.L. Harringa, J. Electron. Mater. 41, 1868 (2012).

3. J.W. Evans, A Guide to Lead-free Solders (London: Springer, 2007).

4. C.M. Gourlay, J. Read, K. Nogita, and A.K. Dahle, J. Electron. Mater. 37, 51 (2008).

5. Y. Zhang, Modern Electroplating, Tin and Tin Alloys for Lead-Free Solder (Hoboken: Wiley, 2010).

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