Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al-Reference-Cited by-同舟云学术

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Published:2012-03-10 Issue:7 Volume:41 Page:1868-1881
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Boesenberg Adam J.,Anderson Iver E.,Harringa Joel L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-1979-8.pdf

Reference13 articles.

1. I.E. Anderson, F.G. Yost, J.F. Smith, C.M. Miller, and R.L. Terpstra, U.S. Patent No. 5,527,628 (18 June 1996).

2. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).

3. K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).

4. IPC Market Research Services, Global Consumption of Tin/Lead Versus Lead Free Solder, IPC, Quarterly Survey; see http://ipc.org . Accessed 16 May 2011

5. I.E. Anderson and R.L. Terpstra, U.S. Patent No. 6,231,691 (15 May 2001).

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